DLC (Cold Plate)

Efficient Coolant Management for

Liquid-Cooled Infrastructure



Our CDU, Rack Manifold and SFN solutions provide precise coolant distribution and heat removal across multiple servers and racks. Designed for scalability and reliability, these systems ensure optimal thermal performance for AI, HPC, high-density data center, Edge and Modular deployments, enabling seamless integration of direct liquid cooling technologies

High Performance

Direct contact with components for superior heat dissipation.

High Performance

Direct contact with components for superior heat dissipation.

High Performance

Direct contact with components for superior heat dissipation.

Energy Efficient

Reduces power consumption while improving performance.

Energy Efficient

Reduces power consumption while improving performance.

Energy Efficient

Reduces power consumption while improving performance.

Scalable

Ideal for a wide range of systems, from server racks to large-scale facilities.

Scalable

Ideal for a wide range of systems, from server racks to large-scale facilities.

Scalable

Ideal for a wide range of systems, from server racks to large-scale facilities.

Features

That Matter

Explore the core capabilities designed to make your work easier, faster, and more efficient without unnecessary complexity.

Variable flow pumps for higher Operating efficiencies

Optimizes energy usage in real time by adjusting flow based on cooling demand.

High fault tolerance – Redundant sensors

Ensures uninterrupted performance with built-in backups for critical monitoring.

Scalable capacity from 200kW to 2000kW per CDU

Flexible performance range to support both growing and high-density deployments.

Configurable motors, BPHE and sensors

Adapt the system to your infrastructure with modular component choices.

Up to 25 microns secondary fluid filtration

Maintains fluid purity to protect components and extend system lifespan.

Dew Point control

Prevents condensation risks by maintaining precise environmental balance.

SS304/SS316L wetted path components

Built with corrosion-resistant materials for durability in demanding conditions.

Integrated HMI + Remote management dashboard

Monitor, control, and optimize operations from a single unified interface.

Designed for rapid serviceability to minimize maintenance

Reduces downtime with easy access and faster maintenance workflows.

Explore Products

and Specifications

Discover Refroid’s range of advanced cooling solutions engineered for efficiency, scalability, and performance across diverse data center environments.

SentraFLO CDU Series

Refroid SentraFLO coolant distribution units (CDUs) are engineered to meet the stringent operational requirements of AI and high-performance computing environments. Each unit is designed to deliver safe, efficient, and reliable thermal management while maintaining precise system-level control.

SentraFLO Series300 kW600 kW800 kW1000 kW1500 kW2000 kW
Primary coolantWaterWaterWaterWaterWaterWater
Primary supply temperature (ASHRAE TC9.9 FWS class)W17 – W45
Primary Pressure Drop (Internal)≤1.5 bar
Primary filtration (optional)500 µm
Secondary coolantDI / PG25
Secondary supply temperature (ASHRAE TC9.9 S class)S25 – S50
Min. Approach Temperature Difference (ATD)4 °C
Secondary fluid flow rates (1.5 LPM/kW)450 LPM900 LPM1200 LPM1500 LPM2250 LPM3000 LPM
Secondary available head (External)3.5 bar3.5 bar3.5 bar3.5 bar3.5 bar3.5 bar
Secondary filtrationUp to 50 µm
Pump arrangementDualDualDualDualDualDual
Power Supply400 V, 3PH, 50/60 Hz400 V, 3PH, 50/60 Hz400 V, 3PH, 50/60 Hz400 V, 3PH, 50/60 Hz400 V, 3PH, 50/60 Hz401 V, 3PH, 50/60 Hz
Rated Power Consumption<5.5 kW<12 kW<15 kW<15 kW<25 kW<35 kW
Dimensions (mm), Width × Depth × Height1000 × 1450 × 21501200 × 1650 × 21501200 × 1650 × 21501200 × 1650 × 21501400 × 1850 × 21501600 × 1850 × 2150
Unit Weight (Dry)Approx. 700 kgApprox. 900 kgApprox. 1000 kgApprox. 1100 kgApprox. 1300 kgApprox. 1600 kg
CommunicationModbus, TCP/IP and others

*All values are indicative purposes and subject to change without prior intimation based on configuration updates. Please contact our team for updated values. 

Supporting Products

& Add-Ons

Complement your Refroid deployment with add-on products designed to enhance performance, integration, and scalability.

SFN & Rack Manifolds

Refroid SFN (Secondary Fluid Network) & Rack Manifold System form the secondary loop of SentraFLO’s Direct-to-Chip Liquid Cooling (DLC) setup. Designed for enabling coolant flow across server racks in a Cluster. They are In-rack mountable, leak-resistant, and built for low pressure drop and easy maintenance.

SentraFLO SFN (Secondary Fluid Network) & Rack Manifold System form the secondary loop of Refroid’s Direct-to-Chip Liquid Cooling (DCLC) setup. Designed for balanced coolant flow across every server node, it’s rack-integrated, leak-resistant, and built for low pressure drop and easy maintenance.

Modular, tool-free components for quick, dripless servicing.

Rack-integrated manifolds for direct cold plate connection.

Designed for

Your Needs

Whether you’re scaling, optimizing, or just starting out, these use cases show how the solution adds value in context.

  • AI and High-Density Compute Environments

  • Retrofit in Legacy Data Centers

  • Edge and Modular Data Centers

  • AI and High-Density Compute Environments

  • Retrofit in Legacy Data Centers

  • Edge and Modular Data Centers